S. L. Burkett

Also published under:S. Burkett, Susan L. Burkett, Susan Burkett

Affiliation

The University of Alabama, Tuscaloosa, AL, USA

Topic

Function Of Frequency,Resistant Parasites,3D Integration,3D Software,3D Stacks,Adhesion Behavior,Adhesion Strength,Adhesive Shear Strength,Air Bubbles,Alignment Marks,Anthocyanin,Back-end-of-line,Barrier Layer,Behavioral Analysis,Berries,Bias Voltage,Blackberry,Bottom Plate,Clock Rate,Conductive,Contact Pads,Crack Length,Crack Propagation,Credit Hours,Data Collection Activities,Defect Model,Delamination,Dielectric Constant,Dielectric Layer,Dye-sensitized Solar Cells,Electrical Performance,Electrolyte,Electroplating,Energy Release Rate,Equivalent Series Resistance,Etching Process,Faculty Mentors,Finite Element,Finite Element Model,Focus Group,Front Side,Grit Size,High Dielectric Constant,High Insertion Loss,High-temperature Process,Increase In Capacity,Increase In Length,Insertion Loss,Interface Crack,Iodide Ions,

Biography

Susan L. Burkett (SM'03) received the B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Missouri, Columbia, in 1985, 1987, and 1992, respectively.
She joined the University of Alabama, Tuscaloosa, in 2008 as the Alabama Power Foundation Endowed Professor in Electrical and Computer Engineering. From 2005 to 2007, she served as Program Director at the National Science Foundation (NSF) in the Division of Undergraduate Education, Arlington, VA. She has funded research projects with the NSF, NASA, and the Army Research Laboratory. She had previous academic appointments at Boise State University, Boise, ID, and the University of Arkansas, Fayetteville. Her current research interests include semiconductor processing and advanced interconnect schemes.
Dr. Burkett is a Co-Chair representing the IEEE Education Society for the 2011 Frontiers in Education Conference. She is a member of the American Vacuum Society, Science and Technology Society, and American Society for Engineering Education.