Reza Abbaspour

Affiliation

School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Topic

Electroplating,Young’s Modulus,ANSYS Workbench,Adaptive Mesh Refinement,Alignment Data,Analog-to-digital Converter,Annealing Temperature,Annealing Temperature Increases,Annealing Treatment,Argon Gas Flow,Assembly Process,Atomic Layer Deposition,Best Fit,Best-fit Curve,Biosensor System,Coolant,Cross-contamination,Cross-sectional Sample,Design Optimization,Effect Of Thermal Annealing,Elastic Deformation,Elastic Modulus Values,Elastic Region,Elasticity Values,Electrical Connection,Electrical Interconnection,Electrode,Electron Backscatter Diffraction,Electron Backscatter Diffraction Measurements,Excessive Pressure,Experimental Scenarios,Fabrication Process,Fabrication Steps,Flexible Interconnection,Flip-chip,Fluid Flow,Four-point Measurement,Fracture Model,Germanium Detector,Glycoprotein Receptor,Grain Growth,Grain Size,Heat Sink,Heat Transfer,High Flux,High Heat Flux,High Power,High Pressure,High-temperature Annealing,High-throughput Testing,

Biography

Reza Abbaspour (S’10) received the master’s degrees in telecommunication engineering and integrated photonics from the University of Vaasa-Finland and the Georgia Institute of Technology (Georgia Tech), USA, respectively. He is currently pursuing the Ph.D. degree in electrical engineering with a minor in material science with Georgia Tech. Prior to that, he was a Research and Development Engineer in Finland.