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Knut E. Aasmundtveit
Also published under:Knut Eilif Aasmundtveit, Knut Aasmundtveit, K. Aasmundtveit, K. E. Aasmundtveit, knut E. Aasmundtveit
Affiliation
Faculty of Technology, Natural Sciences and Maritime Sciences, University of South-Eastern Norway, Vestfold, Norway
Topic
Conductive Particles,Energy-dispersive X-ray Spectroscopy,Phase Diagram,Scanning Electron Microscopy,Adhesive Layer,Antireflection Coatings,Cap Thickness,Contact Pads,Electroplating,Elevated Temperature,Flip-chip,Impedance,Infrared Detector,Maximum Stress,Melting Point,Microfabrication,Particle Deposition,Polymer Spheres,Principal Stress,Si Wafer,Solid–liquid Interdiffusion,Thermal Expansion,Trapped Particles,Vacuum Level,Vertical Cracks,Actuator,Adhesive Joints,Ag Layer,Agglomerates,Airtight,Aluminum Nitride,Amorphous Carbon,Anisotropic Conductivity,Assembly Process,Beginning Of Process,Bi Content,Bi Elements,Board Of Directors,Bond Strength,Bottom Layer,Bottom Side,Bulk Si,Carbon Nanofibers,Carbon Nanotube Growth,Carbon Nanotubes,Carbon Species,Catalyst Layer,Cavity Pressure,Cavity Volume,Chemical Vapor Deposition,
Biography
Knut Eilif Aasmundtveit (Member, IEEE) received the M.Sc. degree in technical physics from the Norwegian Institute of Technology, Trondheim, Norway, in 1994, and the Ph.D. degree in materials physics from the Norwegian University of Science and Technology, Trondheim, in 1999.
In 2004, he was with Kongsberg Norspace, Horten, Norway, as an RF System Design Engineer. Then, he joined the University of South-Eastern Norway (then Vestfold University College), Horten, as an Associate Professor and became a Professor in 2013. He has authored or coauthored six book chapters and more than 100 journal and conference papers. His research interests include packaging and integration technology for micro- and nanosystems, such as intermetallic bonding, polymer-based bonding, nanomaterials integration in microsystems, as well as biomedical packaging.
Dr. Aasmundtveit was the General Chair of ESTC 2020 (IEEE EPS). He serves as a member of the ESTC Steering Committee.
In 2004, he was with Kongsberg Norspace, Horten, Norway, as an RF System Design Engineer. Then, he joined the University of South-Eastern Norway (then Vestfold University College), Horten, as an Associate Professor and became a Professor in 2013. He has authored or coauthored six book chapters and more than 100 journal and conference papers. His research interests include packaging and integration technology for micro- and nanosystems, such as intermetallic bonding, polymer-based bonding, nanomaterials integration in microsystems, as well as biomedical packaging.
Dr. Aasmundtveit was the General Chair of ESTC 2020 (IEEE EPS). He serves as a member of the ESTC Steering Committee.