Topic
- Computing and Processing
- Components, Circuits, Devices and Systems
- Communication, Networking and Broadcast Technologies
- Power, Energy and Industry Applications
- Signal Processing and Analysis
- Robotics and Control Systems
- General Topics for Engineers
- Fields, Waves and Electromagnetics
- Engineered Materials, Dielectrics and Plasmas
- Bioengineering
- Transportation
- Photonics and Electrooptics
- Engineering Profession
- Aerospace
- Geoscience
- Nuclear Engineering
- Career Development
- Emerging Technologies
- Telecommunications
- English for Technical Professionals
William Bicknell
Also published under:W. H. Bicknell, W. Bicknell, William H. Bicknell
Affiliation
General Electric, Louisville, KY, USA
Topic
High Power,Power Conversion,Power Devices,2D Model,Air Force,Air Gap,Analog Circuits,Bond Wires,Ceramic Substrate,Circuit Board,DC-DC Power Converter,Dcdc Converter,Dielectric Layer,Digital Circuits,Digital Components,Digital Technologies,Electromagnetic Actuation,Electromagnetic Force,Equivalent Circuit,Ferrite Core,Ferrite Material,Field Lines,Finite Element Analysis,Fitting Parameters,Flip-chip,Force Prediction,Ground Plane,Heat Sink,Heterogeneous Integration,High Dissipation,High Performance,High Switching Frequency,Impedance,Interconnected Structure,Interconnecting Layer,Low Profile,Low-noise Amplifier,Magnetic Energy,Magnetic Field,Magnetomotive Force,Operating Frequency,Optical Components,Outer Region,Permanent Magnet,Power Conditions,Power Distribution,Power System,Printed Circuit Board,Silicon Devices,Surface-mounted,
Biography
William Bicknell, photograph and biography not available at the time of publication.