Topic
- Computing and Processing
- Components, Circuits, Devices and Systems
- Communication, Networking and Broadcast Technologies
- Power, Energy and Industry Applications
- Signal Processing and Analysis
- Robotics and Control Systems
- General Topics for Engineers
- Fields, Waves and Electromagnetics
- Engineered Materials, Dielectrics and Plasmas
- Bioengineering
- Transportation
- Photonics and Electrooptics
- Engineering Profession
- Aerospace
- Geoscience
- Nuclear Engineering
- Career Development
- Emerging Technologies
- Telecommunications
- English for Technical Professionals
Mali Mahalingam
Also published under:M. Mahalingam
Affiliation
Freescale Semiconductor, Tempe, Arizona, USA
Topic
Air Cavity,Base Station,Heat Sink,Airtight,Assembly Process,Base Station Applications,Bias Point,Ceramic Process,Device Performance,Device Structure,Device Temperature,Duty Cycle,Electrical Performance,Elevated Temperature,Finite Element Method,Finite Element Method Simulations,Heat Flux,Heat Pulse,Heat Transfer,High Linearity,High Performance,High Thermal Conductivity,High-power Microwave,High-volume Production,IR Images,Infrared Imaging,Infrared Microscopy,Interfacial Thermal Resistance,Junction Temperature,Loading Conditions,Low Thermal Resistance,Magnetic Resonance Imaging,Manufacturing Technology,Measurement Methodology,Microwave Pulses,Network Infrastructure,Open Windows,Packaging Materials,Packing Structure,Peak Temperature,Power Amplifier,Pulse Width,Scanning Electron Microscopy,Semiconductor Devices,Si Devices,Single Detection,Small Form Factor,Temperature Measurements,Thermal Conductivity,Thermal Distribution,
Biography
Mali Mahalingam is a Fellow of Technical Staff and Manager, in the RF Division, Freescale Semiconductor, Inc., Tempe, AZ. He has numerous contributions to both technology development and their successful implementation in digital, power, and RF products. He has published over 60 technical papers including many in refereed archival technical journals. His current focus is packaging/assembly/manufacturing technology of high power RFPA's for wireless markets.