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Welcome to the IEEE Symposium on 3D User Interfaces 2017 (3DUI 2017), taking place in Los Angeles, California, on March 18th–19th, 2017.

Presents the table of contents/splash page of the proceedings record.

Presents an index of the authors whose articles are published in the conference proceedings record.

The following topics are dealt with: 3D user interfaces; virtual reality; virtual assistants; 3D user interaction; passive haptics; walking; 3D gesture recognition; augmented reality; and 3D navigation.

The role of metal density around fiducial marks (used for chip alignment) on the quality of chemical-mechanical-planarization (CMP) of Cu bond-pads/electrodes has been meticulously studied via two different layout designs. A gradual increas...

Low-temperature solders are required in three-dimensional integrated circuit (3D ICs) to reduce heat input during soldering and for stacking. Sn-52mass%In alloys (Sn-In alloys) is promising because it has a melting point of 119 °C. However,...

Toward a next generation co-packaged optics (CPO), we have worked on a novel package substrate in which photonics integrated circuits (PICs) are embedded. The substrate can be provided as known good package substrate with optoelectronic con...

As the prevalence of AI and big data computing, memory is becoming a performance bottleneck. 3D memory stacking is proposed to deal with this problem. However, memory physical design is a labor-intensive procedure. To the best of our knowle...

Due to the advantages of low electrical resistance and size miniaturization, Cu-to-Cu direct bonding has become one of the important trends in microelectronic interconnect fabrication. Achieving robust Cu-to-Cu bonding at low temperature, a...

This electronic document is three-dimensional(3D) power IC, which GaN power devices stacked with Si based gate driver IC, is attractive. There is a problem of false turn-on for GaN power devices. The one of the promising candidates for solv...