Browse Conferences
Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects
Integrating Chiplets into advanced packaging technologies presents significant challenges in diagnosing interconnect line defects, primarily due to the immaturity of fabrication processes, reduced interconnect spacing, and increased density...
Low-Temperature Adhesive Hybrid Bonding Technology with Novel Area-Selective Passivation Layer
Hybrid bonding is a crucial technology in 3D IC integration, enabling the combination of different functional chips through vertical interconnections. However, in hybrid bonding, the issue of copper oxidation during the bonding of copper me...
Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology
Hybrid bonding has now become one of the most crucial technologies in the field of 3D IC. However, it requires a high degree of surface flatness and precise surface topography control, which increases the cost and complexity of the process....
Characterization of Ozone-Ethylene Radical Pretreatment for Hybrid Bonding without Water Rinsing Processes
An Ozone-Ethylene Radical (OER) generation technology can produce a highly active oxidizing agent of OH radicals by mixing an unsaturated hydrocarbon gas with a highly concentrated ozone gas. The OH radicals given by the OER treatment are e...
Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies
This paper presents a study of the influence of direct hybrid bonding interconnections on a grounded coplanar waveguide in a 3D integration technology at mm-wave frequencies up to 120 GHz. The considered transmission line is implemented in ...
A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DIC
Hybrid bonding has key advantages such as increasing the I/D bandwidth, reducing signal delay, interconnect power loss, and etc., for next generation High Performance Computing (HPC) requirements. In fact, it hybrid bonding process require ...
Ultra-High Density Deep Trench Capacitor (DTC) for 3DIC Integration
Ultra-high-density IPD capacitor is increasingly essential for high performance computing (HPC), artificial intelligence (AI) systems and mobile application compact systems in 3DFabric platform. Utilizing advanced etching and deposition tec...
16-Layer 3D Stacking Based on Self-Assembly Technology for HBM Application
We address a trade-off issue between chip assembly time and positioning accuracy in a traditional pick-and-place method using self-assembly technology driven by liquid surface tension. This method allows 16-layer stacking of 50-um-thin chip...
Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission Loss
We developed a method to form a copper seed layer directly on resins with excellent dielectric properties using sputtering (referred to as the direct sputtering method). One of the key challenges to implementing 6G wireless communication sy...
Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration
We demonstrate the suitability of a novel blade dicing technique introduced by DISCO that has an output comparable to that of plasma dicing, in terms of particle count and surface cleanliness - known as ‘clean dicing’. This was assessed b...